Patent Assignment Details
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Reel/Frame: | 016614/0130 | |
| Pages: | 2 |
| | Recorded: | 05/27/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/2009
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Application #:
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11138352
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Filing Dt:
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05/27/2005
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Publication #:
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Pub Dt:
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12/01/2005
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Title:
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SILICON-CONTAINING COMPOUND, COMPOSITION CONTAINING SAID COMPOUND, AND INSULATING MATERIAL
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Assignee
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210, NAKANUMA, MINAMI-ASHIGARA-SHI |
KANAGAWA, JAPAN |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, DC 20037
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