Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 037211/0130 | |
| Pages: | 14 |
| | Recorded: | 12/02/2015 | | |
| Attorney Dkt #: | 5610/0314M |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
10
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Patent #:
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Issue Dt:
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12/14/2010
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Application #:
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12236182
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Filing Dt:
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09/23/2008
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Publication #:
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Pub Dt:
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12/31/2009
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Title:
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FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES
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Patent #:
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Issue Dt:
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03/19/2013
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Application #:
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12539757
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Filing Dt:
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08/12/2009
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Publication #:
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Pub Dt:
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02/18/2010
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Title:
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LIGHT-EMITTING DIODE WITH CURRENT-SPREADING REGION
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Patent #:
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Issue Dt:
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02/03/2015
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Application #:
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12897124
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Filing Dt:
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10/04/2010
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Publication #:
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Pub Dt:
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10/06/2011
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Title:
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NOVEL SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS
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Patent #:
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Issue Dt:
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04/02/2013
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Application #:
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13094344
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Filing Dt:
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04/26/2011
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Publication #:
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Pub Dt:
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11/01/2012
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Title:
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METHOD AND STRUCTURE FOR LED WITH NANO-PATTERNED SUBSTRATE
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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13227703
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Filing Dt:
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09/08/2011
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Publication #:
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Pub Dt:
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12/29/2011
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Title:
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PACKAGE FOR A LIGHT EMITTING ELEMENT
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Patent #:
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Issue Dt:
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12/17/2013
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Application #:
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13253797
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Filing Dt:
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10/05/2011
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Publication #:
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Pub Dt:
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05/03/2012
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Title:
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LIGHT EMITTING DIODE OPTICAL EMITTER WITH TRANSPARENT ELECTRICAL CONNECTORS
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Patent #:
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Issue Dt:
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02/25/2014
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Application #:
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13267701
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Filing Dt:
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10/06/2011
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Publication #:
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Pub Dt:
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02/02/2012
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Title:
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Light-Emitting Diode with Textured Substrate
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Patent #:
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Issue Dt:
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12/09/2014
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Application #:
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13273850
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Filing Dt:
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10/14/2011
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Publication #:
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Pub Dt:
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05/03/2012
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Title:
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LIGHT-EMITTING DIODE LAMP AND METHOD OF MAKING
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Patent #:
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Issue Dt:
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03/19/2013
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Application #:
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13474282
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Filing Dt:
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05/17/2012
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Publication #:
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Pub Dt:
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09/06/2012
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Title:
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LED Flip-Chip Package Structure with Dummy Bumps
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Patent #:
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Issue Dt:
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11/26/2013
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Application #:
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13557315
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Filing Dt:
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07/25/2012
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Publication #:
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Pub Dt:
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11/15/2012
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Title:
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Light Emitting Diode Light Bar Module with Electrical Connectors Formed by Injection Molding
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Assignee
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| NO. 9 LIXING 4TH RD. |
| HSINCHU SCIENCE AND INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, P.C.
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4000 LEGATO ROAD
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SUITE 310
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FAIRFAX, VA 22033
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