Patent Assignment Details
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| Reel/Frame: | 013615/0131 | |
| Pages: | 3 |
| | Recorded: | 12/26/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10253235
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Filing Dt:
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09/24/2002
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Publication #:
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Pub Dt:
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04/24/2003
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Title:
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METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT, INTEGRATED CIRCUIT OBTAINED IN ACCORDANCE WITH SAID METHOD, WAFER PROVIDED WITH AN INTEGRATED CIRCUIT OBTAINED IN ACCORDANCE WITH THE METHOD, AND SYSTEM COMPRISING AN INTEGRATED CIRCUIT OBTAINED BY MEANS OF THE METHOD
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Assignee
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| GROENEWOUDSEWEG 1 |
| 5621 BA EINDHOVEN, NETHERLANDS |
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Correspondence name and address
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PHILIPS ELECTRONICS NORTH AMERICA CORP.
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STEVEN R. BIREN
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580 WHITE PLAINS ROAD
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TARRYTOWN, NY 10591
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