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Reel/Frame:025049/0132   Pages: 3
Recorded: 09/28/2010
Attorney Dkt #:US32188
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/23/2015
Application #:
12891815
Filing Dt:
09/28/2010
Publication #:
Pub Dt:
08/04/2011
Title:
SEMICONDUCTOR LIGHTING MODULE PACKAGE
Assignor
1
Exec Dt:
09/23/2010
Assignee
1
NO. 13, GONGYE 5TH RD., HSINCHU INDUSTRIAL PARK,HUKOU SHIANG
HSINCHU HSIEN 303, TAIWAN
Correspondence name and address
RAYMOND J. CHEW
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY, CA 91789

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