Patent Assignment Details
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| Reel/Frame: | 025049/0132 | |
| Pages: | 3 |
| | Recorded: | 09/28/2010 | | |
| Attorney Dkt #: | US32188 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/23/2015
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Application #:
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12891815
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Filing Dt:
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09/28/2010
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Publication #:
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Pub Dt:
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08/04/2011
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Title:
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SEMICONDUCTOR LIGHTING MODULE PACKAGE
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Assignee
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| NO. 13, GONGYE 5TH RD., HSINCHU INDUSTRIAL PARK,HUKOU SHIANG |
| HSINCHU HSIEN 303, TAIWAN |
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Correspondence name and address
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RAYMOND J. CHEW
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288 SOUTH MAYO AVENUE
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CITY OF INDUSTRY, CA 91789
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06/28/2024 12:37 PM
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