Total properties:
13
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Patent #:
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Issue Dt:
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11/28/2006
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Application #:
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10236396
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Filing Dt:
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09/06/2002
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Publication #:
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Pub Dt:
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12/18/2003
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Title:
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BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION
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Patent #:
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Issue Dt:
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10/12/2010
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Application #:
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11455028
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Filing Dt:
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07/24/2006
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Publication #:
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Pub Dt:
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01/25/2007
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Title:
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BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION
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Patent #:
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Issue Dt:
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01/12/2010
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Application #:
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11517859
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Filing Dt:
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09/07/2006
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Publication #:
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Pub Dt:
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09/06/2007
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Title:
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BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION
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Patent #:
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Issue Dt:
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03/08/2011
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Application #:
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11517860
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Filing Dt:
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09/07/2006
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Publication #:
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Pub Dt:
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01/04/2007
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Title:
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BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION
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Patent #:
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Issue Dt:
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05/01/2012
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Application #:
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11926053
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Filing Dt:
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10/28/2007
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Publication #:
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Pub Dt:
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10/09/2008
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Title:
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ELECTRODE ARRAY
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Patent #:
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Issue Dt:
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11/16/2010
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Application #:
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11928515
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Filing Dt:
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10/30/2007
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Publication #:
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Pub Dt:
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02/28/2008
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Title:
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ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION
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Patent #:
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Issue Dt:
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04/24/2012
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Application #:
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12899451
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Filing Dt:
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10/06/2010
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Publication #:
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Pub Dt:
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01/26/2012
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Title:
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ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION
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Patent #:
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Issue Dt:
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11/04/2014
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Application #:
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13009769
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Filing Dt:
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01/19/2011
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Publication #:
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Pub Dt:
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05/19/2011
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Title:
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BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION
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Patent #:
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Issue Dt:
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03/14/2017
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Application #:
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13351899
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Filing Dt:
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01/17/2012
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Publication #:
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Pub Dt:
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05/31/2012
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Title:
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Biocompatible Bonding Method and Electronics Package Suitable for Implantation
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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13610653
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Filing Dt:
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09/11/2012
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Publication #:
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Pub Dt:
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01/03/2013
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Title:
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Electronics Package Suitable for Implantation
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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14516476
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Filing Dt:
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10/16/2014
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Publication #:
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Pub Dt:
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10/15/2015
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Title:
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BIOCOMPATIBLE BONDING METHOD SUITABLE FOR IMPLANTATION
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Patent #:
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Issue Dt:
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12/25/2018
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Application #:
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14941311
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Filing Dt:
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11/13/2015
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Publication #:
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Pub Dt:
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06/09/2016
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Title:
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Biocompatible Bonding Method and Electronics Package Suitable for Implantation
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Patent #:
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Issue Dt:
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12/26/2017
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Application #:
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15356466
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Filing Dt:
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11/18/2016
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Publication #:
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Pub Dt:
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04/06/2017
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Title:
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Biocompatible Bonding Method and Electronics Package Suitable for Implantation
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