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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	062588/0132			Pages:	4
		Recorded:	02/03/2023
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 13

Patent #:	7142909	Issue Dt:	11/28/2006	Application #:	10236396	Filing Dt:	09/06/2002
Publication #:	US20030233134	Pub Dt:	12/18/2003
Title:	BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION

Patent #:	7813796	Issue Dt:	10/12/2010	Application #:	11455028	Filing Dt:	07/24/2006
Publication #:	US20070021787	Pub Dt:	01/25/2007
Title:	BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION

Patent #:	7645262	Issue Dt:	01/12/2010	Application #:	11517859	Filing Dt:	09/07/2006
Publication #:	US20070207569	Pub Dt:	09/06/2007
Title:	BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION

Patent #:	7904148	Issue Dt:	03/08/2011	Application #:	11517860	Filing Dt:	09/07/2006
Publication #:	US20070005112	Pub Dt:	01/04/2007
Title:	BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION

Patent #:	7835794	Issue Dt:	11/16/2010	Application #:	11928515	Filing Dt:	10/30/2007
Publication #:	US20080051848	Pub Dt:	02/28/2008
Title:	ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION

Patent #:	8165680	Issue Dt:	04/24/2012	Application #:	12899451	Filing Dt:	10/06/2010
Publication #:	US20120022625	Pub Dt:	01/26/2012
Title:	ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION

Patent #:	8880165	Issue Dt:	11/04/2014	Application #:	13009769	Filing Dt:	01/19/2011
Publication #:	US20110118808	Pub Dt:	05/19/2011
Title:	BIOCOMPATIBLE BONDING METHOD AND ELECTRONICS PACKAGE SUITABLE FOR IMPLANTATION

Patent #:	9592396	Issue Dt:	03/14/2017	Application #:	13351899	Filing Dt:	01/17/2012
Publication #:	US20120131794	Pub Dt:	05/31/2012
Title:	Biocompatible Bonding Method and Electronics Package Suitable for Implantation

Patent #:	8644937	Issue Dt:	02/04/2014	Application #:	13610653	Filing Dt:	09/11/2012
Publication #:	US20130006340	Pub Dt:	01/03/2013
Title:	Electronics Package Suitable for Implantation

Patent #:	9258902	Issue Dt:	02/09/2016	Application #:	14516476	Filing Dt:	10/16/2014
Publication #:	US20150296628	Pub Dt:	10/15/2015
Title:	BIOCOMPATIBLE BONDING METHOD SUITABLE FOR IMPLANTATION

Patent #:	10159845	Issue Dt:	12/25/2018	Application #:	14941311	Filing Dt:	11/13/2015
Publication #:	US20160158559	Pub Dt:	06/09/2016
Title:	Biocompatible Bonding Method and Electronics Package Suitable for Implantation

Patent #:	9849297	Issue Dt:	12/26/2017	Application #:	15356466	Filing Dt:	11/18/2016
Publication #:	US20170095671	Pub Dt:	04/06/2017
Title:	Biocompatible Bonding Method and Electronics Package Suitable for Implantation

Assignor

Exec Dt:

12/28/2022

Assignee

13170 TELFAIR AVENUE

SYLMAR, CALIFORNIA 91342

Correspondence name and address
	SCOTT DUNBAR
	13170 TELFAIR AVENUE
	SYLMAR, CA 91342

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