Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027295/0133 | |
| Pages: | 3 |
| | Recorded: | 11/29/2011 | | |
| Attorney Dkt #: | 054911 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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08/30/1994
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Application #:
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08155539
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Filing Dt:
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11/22/1993
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Title:
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SEMICONDUCTOR DEVICE WITH AN AIRTIGHT FORMED INTERNALLY WITHIN A HOLLOW PACKAGE
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Patent #:
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Issue Dt:
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04/11/2000
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Application #:
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08260977
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Filing Dt:
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06/15/1994
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Title:
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A PROCESS FOR MANUFACTURING A SEMICONDUCTOR DEVICE WITH AN AIRTIGHT SPACE FORMED INTERNALLY WITHIN A HOLLOW PACKAGE
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Patent #:
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Issue Dt:
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07/11/2000
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Application #:
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09047413
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Filing Dt:
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03/25/1998
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Title:
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PLASTIC PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING PLASTIC PACKAGE
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Patent #:
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Issue Dt:
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07/20/2004
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Application #:
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10329558
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Filing Dt:
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12/27/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Title:
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CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
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Patent #:
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Issue Dt:
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08/10/2004
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Application #:
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10425614
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Filing Dt:
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04/30/2003
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Publication #:
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Pub Dt:
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11/13/2003
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Title:
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PACKAGE FOR MOUNTING A SOLID STATE IMAGE SENSOR
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Assignee
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| 1-7-43, KITA-KUNOMOTO, |
| TENDO-SHI, YAMAGATA-KEN, JAPAN |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE, NW
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SUITE 800
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WASHINGTON, DC 20036
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