Patent Assignment Details
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Reel/Frame: | 027331/0133 | |
| Pages: | 3 |
| | Recorded: | 11/10/2011 | | |
Attorney Dkt #: | 15639-000033/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/07/2015
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Application #:
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13213730
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Filing Dt:
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08/19/2011
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Publication #:
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Pub Dt:
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03/08/2012
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Title:
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HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDING A JUNCTION PART MADE OF THE HEAT DISSIPATION MATERIAL
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Assignee
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416, MAETAN-DONG, |
YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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