Patent Assignment Details
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Reel/Frame: | 018755/0134 | |
| Pages: | 2 |
| | Recorded: | 01/12/2007 | | |
Attorney Dkt #: | A400:58696/DBP |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/13/2009
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Application #:
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11590640
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Filing Dt:
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10/30/2006
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Publication #:
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Pub Dt:
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05/10/2007
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Title:
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METHOD OF GRINDING BACK SURFACE OF SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER GRINDING APPARATUS
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Assignee
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7-1, SHIMORENJAKU 9-CHOME |
MITAKA-SHI, TOKYO, JAPAN |
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Correspondence name and address
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CHRISTIE, PARKER & HALE, LLP
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P.O. BOX 7068
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PASADENA, CA 91109-7068
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