Patent Assignment Details
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Reel/Frame: | 025671/0135 | |
| Pages: | 4 |
| | Recorded: | 01/20/2011 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/20/2012
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Application #:
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12934788
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Filing Dt:
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01/20/2011
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Publication #:
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Pub Dt:
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05/05/2011
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Title:
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METHOD FOR MANUFACTURING BONDED WAFER
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Assignee
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6-1, OTEMACHI 2-CHOME |
CHIYODA-KU, TOKYO 1000004, JAPAN |
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Correspondence name and address
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JOSEPH H. KARLIN
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LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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