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Patent #:
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09/20/2005
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10286269
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10/31/2002
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Publication #:
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Pub Dt:
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03/27/2003
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Title:
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09/14/2004
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10286589
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10/31/2002
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Pub Dt:
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03/27/2003
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Title:
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IMAGE SENSOR PACKAGE
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Issue Dt:
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06/14/2005
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10291050
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Filing Dt:
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11/08/2002
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Title:
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Issue Dt:
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04/06/2004
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10306627
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11/26/2002
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Publication #:
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Pub Dt:
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05/29/2003
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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01/17/2006
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10319022
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Filing Dt:
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12/12/2002
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Title:
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Patent #:
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Issue Dt:
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09/28/2004
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10329620
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12/26/2002
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Title:
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PRE-MOLDED LEADFRAME
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08/17/2004
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10340256
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01/10/2003
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Title:
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12/21/2004
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10354772
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01/30/2003
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Title:
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INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES
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04/20/2004
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10356046
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01/31/2003
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Pub Dt:
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06/19/2003
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Title:
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METHOD OF MAKING A SEMICONDUCTOR PACKAGE HAVING EXPOSED METAL STRAP
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11/15/2005
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10356997
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02/03/2003
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Title:
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REINFORCED LEAD-FRAME ASSEMBLY FOR INTERCONNECTING CIRCUITS WITHIN A CIRCUIT MODULE
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01/25/2005
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10358621
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02/05/2003
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Title:
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04/12/2005
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10370013
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02/19/2003
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Title:
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STACKING STRUCTURE FOR SEMICONDUCTOR DEVICES USING A FOLDED OVER FLEXIBLE SUBSTRATE AND METHOD THEREFOR
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06/15/2004
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10376988
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02/28/2003
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Title:
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SEMICONDUCTOR PACKAGE CAPABLE OF DIE STACKING
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08/09/2005
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10383504
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03/07/2003
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Title:
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SEMICONDUCTOR PACKAGE EXHIBITING EFFICIENT LEAD PLACEMENT
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09/21/2004
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10387801
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03/13/2003
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Title:
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LEADFRAME PACKAGE FOR SEMICONDUCTOR DEVICES
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Issue Dt:
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08/16/2005
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10392738
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03/19/2003
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Title:
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INTEGRATED CIRCUIT SUBSTRATE HAVING LAMINATED LASER-EMBEDDED CIRCUIT LAYERS
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02/08/2005
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10420977
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04/22/2003
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Title:
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SEMICONDUCTOR PACKAGE USING A PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME
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10/12/2004
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10423702
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04/25/2003
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10/23/2003
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Title:
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WIRE BONDING METHOD FOR A SEMICONDUCTOR PACKAGE
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Issue Dt:
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12/21/2004
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10425134
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04/28/2003
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Title:
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THIN PROFILE SEMICONDUCTOR PACKAGE WHICH REDUCES WARPAGE AND DAMAGE DURING LASER MARKINGS
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Issue Dt:
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08/22/2006
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10427117
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05/01/2003
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Title:
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LEADFRAME BASED MEMORY CARD
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04/12/2005
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10427118
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05/01/2003
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE
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Patent #:
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04/26/2005
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10427610
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04/30/2003
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Pub Dt:
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11/06/2003
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Title:
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SHEET RESIN COMPOSITION AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE THEREWITH
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11/23/2004
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10435888
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05/12/2003
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Title:
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SEMICONDUCTOR PACKAGE HAVING MORE RELIABLE ELECTRICAL CONDUCTIVE PATTERNS
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Patent #:
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05/03/2005
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10437749
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05/14/2003
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Pub Dt:
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11/27/2003
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Title:
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COLOR CONTACTS FOR A SEMICONDUCTOR PACKAGE
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05/16/2006
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10439671
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05/16/2003
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Publication #:
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Pub Dt:
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10/23/2003
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
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Patent #:
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Issue Dt:
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03/07/2006
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10445754
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05/27/2003
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Title:
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LEADFRAME STRIP HAVING ENHANCED TESTABILITY
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Issue Dt:
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04/05/2005
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10447012
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05/28/2003
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Title:
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SEMICONDUCTOR PACKAGE WITH INCREASED NUMBER OF INPUT AND OUTPUT PINS
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05/24/2005
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10459097
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06/11/2003
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Title:
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FULLY-MOLDED LEADFRAME STAND-OFF FEATURE
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02/27/2007
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10459230
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06/11/2003
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Title:
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LEAD FRAME WITH PLATED END LEADS
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01/03/2006
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10600931
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06/20/2003
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01/15/2004
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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11/01/2005
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10601938
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06/23/2003
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03/18/2004
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Title:
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ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS
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04/18/2006
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10603878
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06/24/2003
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Title:
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INTEGRATED CIRCUIT SUBSTRATE HAVING LASER-EXPOSED TERMINALS
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02/03/2009
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10607324
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06/26/2003
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Title:
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DROP RESISTANT BUMPERS FOR FULLY MOLDED MEMORY CARDS
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03/29/2005
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10610016
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06/30/2003
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THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
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06/28/2005
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10614440
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07/03/2003
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Title:
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DOUBLE DOWNSET DOUBLE DAMBAR SUSPENDED LEADFRAME
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03/29/2005
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10618192
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07/11/2003
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Title:
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POWER SEMICONDUCTOR PACKAGE WITH STRAP
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05/23/2006
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10621780
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07/16/2003
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MULTI-CHIP SEMICONDUCTOR PACKAGE WITH INTEGRAL SHIELD AND ANTENNA
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09/05/2006
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10625290
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07/23/2003
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Title:
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CIRCUIT MODULE HAVING INTERCONNECTS FOR CONNECTING FUNCTIONING AND NON-FUNCTIONING ADD ONS AND METHOD THEREFOR
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07/04/2006
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10626150
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07/24/2003
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Title:
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PLASTIC INTEGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
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09/04/2012
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10634541
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08/04/2003
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Title:
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SEMICONDUCTOR MEMORY CARD
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04/10/2012
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10662248
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09/15/2003
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03/25/2004
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NEAR CHIP SIZE SEMICONDUCTOR PACKAGE
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07/17/2007
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10667226
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09/18/2003
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EXPOSED LEAD INTERPOSER LEADFRAME PACKAGE
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06/06/2006
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10667227
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09/18/2003
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05/20/2004
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LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
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07/26/2005
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10669820
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09/24/2003
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03/24/2005
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REINFORCED DIE PAD SUPPORT STRUCTURE
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08/30/2005
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10672886
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09/26/2003
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SEMICONDUCTOR PACKAGE STRUCTURE REDUCING WARPAGE AND MANUFACTURING METHOD THEREOF
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01/25/2005
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10680280
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10/07/2003
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04/08/2004
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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02/14/2006
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10680281
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10/07/2003
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FRONT EDGE CHAMFER FEATURE FOR FULLY-MOLDED MEMORY CARDS
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11/22/2005
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10688138
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10/17/2003
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MOUNTING FOR A PACKAGE CONTAINING A CHIP
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05/17/2005
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10688710
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10/17/2003
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METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
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02/24/2009
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10689976
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10/21/2003
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07/01/2004
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STACKED ELECTRONIC STRUCTURES INCLUDING OFFSET SUBSTRATES
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11/21/2006
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10690193
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10/21/2003
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Title:
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Semiconductor package including leads and conductive posts for providing increased functionality
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12/20/2005
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10702274
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11/05/2003
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STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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12/05/2006
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10703301
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11/07/2003
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MANUFACTURING METHOD FOR LEADFRAME AND FOR SEMICONDUCTOR PACKAGE USING THE LEADFRAME
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08/16/2005
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10705194
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11/10/2003
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STACKED SEMICONDUCTOR DIE ASSEMBLY HAVING AT LEAST ONE SUPPORT
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05/01/2007
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10706468
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11/12/2003
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SEMICONDUCTOR PACKAGE WITH CHAMFERED CORNERS AND METHOD OF MANUFACTURING THE SAME
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08/15/2006
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10735184
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12/11/2003
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IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURE THEREOF
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11/15/2005
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10737572
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12/16/2003
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SEMICONDUCTOR PACKAGE WITH EXPOSED DIE PAD AND BODY-LOCKING LEADFRAME
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03/07/2006
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10759990
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01/15/2004
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SEMICONDUCTOR PACKAGE WITH SUBSTRATE COUPLED TO A PERIPHERAL SIDE SURFACE OF A SEMICONDUCTOR DIE
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10/03/2006
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10763859
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01/23/2004
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08/05/2004
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SEMICONDUCTOR PACKAGE HAVING REDUCED THICKNESS
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06/06/2006
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10765397
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01/27/2004
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CAVITY CASE WITH CLIP/PLUG FOR USE ON MULTI-MEDIA CARD
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08/15/2006
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10766046
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01/28/2004
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LEADFRAME TYPE SEMICONDUCTOR PACKAGE HAVING REDUCED INDUCTANCE AND ITS MANUFACTURING METHOD
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12/15/2009
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10766101
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01/28/2004
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DOUBLE MOLD MEMORY CARD AND ITS MANUFACTURING METHOD
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07/19/2005
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10771072
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02/02/2004
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STRUCTURES FOR IMPROVING HEAT DISSIPATION IN STACKED SEMICONDUCTOR PACKAGES
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01/30/2007
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10774893
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02/09/2004
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08/19/2004
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LEAD FRAME FOR SEMICONDUCTOR PACKAGE
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07/25/2006
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10780529
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02/17/2004
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10/21/2004
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METHODS OF SELECTIVELY BUMPING INTEGRATED CIRCUIT SUBSTRATES AND RELATED STRUCTURES
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01/18/2005
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02/18/2004
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Title:
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LEADFRAME PACKAGE FOR SEMICONDUCTOR DEVICES
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03/13/2007
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10785528
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02/24/2004
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08/26/2004
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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01/02/2007
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10790967
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03/02/2004
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09/02/2004
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LOW TEMPERATURE METHODS OF BONDING COMPONENTS AND RELATED STRUCTURES
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06/13/2006
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10803333
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03/17/2004
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09/09/2004
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STACKABLE SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL THROUGH HOLE OF SUBSTRATE
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03/06/2007
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10806640
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03/23/2004
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METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
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02/26/2008
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10825670
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04/14/2004
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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07/11/2006
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Application #:
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10828616
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Filing Dt:
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04/21/2004
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Title:
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TAPE SUPPORTED MEMORY CARD LEADFRAME STRUCTURE
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Patent #:
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Issue Dt:
|
09/20/2005
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Application #:
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10831505
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Filing Dt:
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04/22/2004
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Title:
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SEMICONDUCTOR PACKAGE HAVING ONE OR MORE DIE STACKED ON A PREPACKAGED DEVICE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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02/23/2010
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Application #:
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10837830
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Filing Dt:
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05/03/2004
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Publication #:
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Pub Dt:
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10/21/2004
| | | | |
Title:
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ELECTRONIC DEVICES INCLUDING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING
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Patent #:
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|
Issue Dt:
|
12/05/2006
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Application #:
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10839647
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Filing Dt:
|
05/05/2004
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Title:
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SEMICONDUCTOR PACKAGE AND SUBSTRATE HAVING MULTI-LEVEL VIAS
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Patent #:
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Issue Dt:
|
02/28/2006
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Application #:
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10847742
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Filing Dt:
|
05/18/2004
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Title:
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METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
12/05/2006
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Application #:
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10865096
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Filing Dt:
|
06/09/2004
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Title:
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SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
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Patent #:
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|
Issue Dt:
|
03/13/2007
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Application #:
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10868244
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Filing Dt:
|
06/15/2004
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Title:
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EMBEDDED LEADFRAME SEMICONDUCTOR PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
06/27/2006
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Application #:
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10868643
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Filing Dt:
|
06/15/2004
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Publication #:
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Pub Dt:
|
11/18/2004
| | | | |
Title:
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SEMICONDUCTOR PACKAGE HAVING IMPROVED ADHESIVENESS AND GROUND BONDING
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Patent #:
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|
Issue Dt:
|
07/17/2007
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Application #:
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10879411
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Filing Dt:
|
06/29/2004
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Publication #:
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Pub Dt:
|
01/27/2005
| | | | |
Title:
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METHODS OF FORMING CONDUCTIVE STRUCTURES INCLUDING TITANIUM-TUNGSTEN BASE LAYERS AND RELATED STRUCTURES
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|
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Patent #:
|
|
Issue Dt:
|
05/01/2007
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Application #:
|
10881846
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Filing Dt:
|
06/30/2004
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Title:
|
EXPOSED LEAD QFP PACKAGE FABRICATED THROUGH THE USE OF A PARTIAL SAW PROCESS
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|
|
Patent #:
|
|
Issue Dt:
|
01/17/2006
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Application #:
|
10883593
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Filing Dt:
|
06/30/2004
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Title:
|
STACKABLE SEMICONDUCTOR PACKAGE WITH SOLDER ON PADS ON WHICH SECOND SEMICONDUCTOR PACKAGE IS STACKED
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|
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Patent #:
|
|
Issue Dt:
|
04/18/2006
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Application #:
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10884082
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Filing Dt:
|
07/01/2004
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Publication #:
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|
Pub Dt:
|
01/06/2005
| | | | |
Title:
|
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND WIRE BONDING METHOD USING THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
05/16/2006
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Application #:
|
10892625
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Filing Dt:
|
07/15/2004
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Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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|
|
Patent #:
|
|
Issue Dt:
|
10/06/2009
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Application #:
|
10910089
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Filing Dt:
|
08/03/2004
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Title:
|
OFFSET ETCHED CORNER LEADS FOR SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/10/2007
|
Application #:
|
10921642
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Filing Dt:
|
08/19/2004
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Title:
|
SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
09/05/2006
|
Application #:
|
10923575
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Filing Dt:
|
08/20/2004
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Title:
|
PRE-MOLDED LEADFRAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/18/2005
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Application #:
|
10928475
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Filing Dt:
|
08/26/2004
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Publication #:
|
|
Pub Dt:
|
02/03/2005
| | | | |
Title:
|
IMAGE SENSOR PACKAGE FABRICATION METHOD
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|
|
Patent #:
|
|
Issue Dt:
|
10/11/2005
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Application #:
|
10944241
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Filing Dt:
|
09/17/2004
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Publication #:
|
|
Pub Dt:
|
03/24/2005
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2006
|
Application #:
|
10944314
|
Filing Dt:
|
09/17/2004
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Publication #:
|
|
Pub Dt:
|
02/10/2005
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP
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|
|
Patent #:
|
|
Issue Dt:
|
07/15/2008
|
Application #:
|
10947124
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Filing Dt:
|
09/22/2004
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Publication #:
|
|
Pub Dt:
|
02/24/2005
| | | | |
Title:
|
METHOD FOR MAKING AN INTEGRATED CIRCUIT SUBSTRATE HAVING EMBEDDED BACK-SIDE ACCESS CONDUCTORS AND VIAS
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|
|
Patent #:
|
|
Issue Dt:
|
04/15/2008
|
Application #:
|
10962221
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Filing Dt:
|
10/08/2004
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Title:
|
IMAGE SENSOR PACKAGE AND ITS MANUFACTURING METHOD
|
|
|
Patent #:
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|
Issue Dt:
|
05/23/2006
|
Application #:
|
10965640
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Filing Dt:
|
10/13/2004
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Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
Title:
|
METHODS OF PROVIDING SOLDER STRUCTURES FOR OUT PLANE CONNECTIONS
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|
|
Patent #:
|
|
Issue Dt:
|
04/10/2007
|
Application #:
|
10967462
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Filing Dt:
|
10/18/2004
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Title:
|
MEMORY CARD AND ITS MANUFACTURING METHOD
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|
|
Patent #:
|
|
Issue Dt:
|
05/15/2007
|
Application #:
|
10971408
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Filing Dt:
|
10/22/2004
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Title:
|
FAN-IN LEADFRAME SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2011
|
Application #:
|
10972686
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Filing Dt:
|
10/25/2004
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Publication #:
|
|
Pub Dt:
|
02/19/2009
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE HAVING A PLURALITY INPUT/OUTPUT MEMBERS
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|
|
Patent #:
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|
Issue Dt:
|
03/20/2007
|
Application #:
|
10980355
|
Filing Dt:
|
11/03/2004
|
Title:
|
MEMORY CARD ESC SUBSTRATE INSERT
|
|
|
Patent #:
|
|
Issue Dt:
|
08/07/2007
|
Application #:
|
10986634
|
Filing Dt:
|
11/12/2004
|
Title:
|
INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2008
|
Application #:
|
10990265
|
Filing Dt:
|
11/16/2004
|
Title:
|
INTERPOSER FOR INTERCONNECTING COMPONENTS IN A MEMORY CARD
|
|
|
Patent #:
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|
Issue Dt:
|
07/04/2006
|
Application #:
|
10991631
|
Filing Dt:
|
11/17/2004
|
Title:
|
STACKED-DIE EXTENSION SUPPORT STRUCTURE AND METHOD THEREOF
|
|