Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067568/0139 | |
| Pages: | 11 |
| | Recorded: | 05/30/2024 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATS FROM STSTS CHIPPAC PTE. LTE. TO STSTS CHIPPAC LTD. AND CORRECT THE NAME OF RECEOVING PARTY DATA FROM STSTS CHIPPAC PTE. LTE. TO STSTS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 64838 FRAME: 948. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/23/2010
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Application #:
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12037084
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Filing Dt:
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02/25/2008
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Publication #:
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Pub Dt:
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09/04/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDERFILL
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE |
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Correspondence name and address
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YANGZHOU DU
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8407 CENTRAL AVE, SUITE 2077
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NEWARK, CA 94560-3431
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