Patent Assignment Details
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Reel/Frame: | 040055/0140 | |
| Pages: | 3 |
| | Recorded: | 10/19/2016 | | |
Attorney Dkt #: | P8090US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15296770
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Filing Dt:
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10/18/2016
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Publication #:
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Pub Dt:
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02/09/2017
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Title:
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BOND PAD STRUCTURE FOR LOW TEMPERATURE FLIP CHIP BONDING
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Assignee
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P.O. BOX 309 |
UGLAND HOUSE |
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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Correspondence name and address
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DITTHAVONG & STEINER, P.C.
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44 CANAL CENTER PLAZA
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SUITE 322
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ALEXANDRIA, VA 22314
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