Patent Assignment Details
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| Reel/Frame: | 050185/0140 | |
| Pages: | 8 |
| | Recorded: | 08/27/2019 | | |
| Attorney Dkt #: | CK-003 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16387924
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Filing Dt:
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04/18/2019
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Publication #:
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Pub Dt:
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10/22/2020
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Title:
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CHIP SCALE PACKAGE INCLUDING PROTECTIVE LAYERS EXHIBITING COUNTERACTING COEFFICIENTS OF THERMAL EXPANSION
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Assignee
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| 100, AMKOR-RO, BUK-GU |
| GWANGJU, KOREA, REPUBLIC OF 61006 |
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Correspondence name and address
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SPECTRUM IP LAW GROUP LLC
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558 CASTLE PINES PARKWAY
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B4-362
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CASTLE PINES, CO 80108
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