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Patent Assignment Details
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Reel/Frame:012958/0141   Pages: 5
Recorded: 06/11/2002
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
06/26/2001
Application #:
09526641
Filing Dt:
03/16/2000
Title:
Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
2
Patent #:
Issue Dt:
08/20/2002
Application #:
09849629
Filing Dt:
05/04/2001
Publication #:
Pub Dt:
12/06/2001
Title:
HIGHLY CONDUCTIVE MOLDING COMPOUNDS FOR USE AS FUEL CELL PLATES AND THE RESULTING PRODUCTS
3
Patent #:
Issue Dt:
04/02/2002
Application #:
09879327
Filing Dt:
06/12/2001
Publication #:
Pub Dt:
01/17/2002
Title:
Process of injection molding highly conductive molding compounds and an apparatus for this process
Assignor
1
Exec Dt:
05/17/2002
Assignee
1
500 WEST MONROE STREET
CHICAGO, ILLINOIS 60661
Correspondence name and address
FEDERAL RESEARCH CORP
REBECCA L. FOLEY
400 SEVENTH STREET NW
SUITE 101
WASHINGTON, DC 20004

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