Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 018745/0142 | |
| Pages: | 2 |
| | Recorded: | 12/27/2006 | | |
Attorney Dkt #: | 10024.0055 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11645523
|
Filing Dt:
|
12/27/2006
|
Publication #:
|
|
Pub Dt:
|
07/05/2007
| | | | |
Title:
|
Method for forming a copper metal interconnection of a semiconductor device
|
|
Assignee
|
|
|
891-10, DAECHI-DONG, GANGNAM-GU |
SEOUL, KOREA, REPUBLIC OF 135-280 |
|
Correspondence name and address
|
|
FINNEGAN, HENDERSON, FARABOW, ET AL.
|
|
901 NEW YORK AVENUE, NW
|
|
WASHINGTON, D.C. 20001-4413
|
Search Results as of:
09/25/2024 04:02 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|