Patent Assignment Details
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Reel/Frame: | 019230/0142 | |
| Pages: | 2 |
| | Recorded: | 04/30/2007 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11629888
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Filing Dt:
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04/30/2007
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Publication #:
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Pub Dt:
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02/21/2008
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Title:
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Copper-Containing Tin Powder, Method for Producing the Copper-Containing Tin Powder and Electro-Conductive Paste Using the Copper-Containing Tin Powder
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Assignee
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11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
TOKYO 141-8584, JAPAN |
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Correspondence name and address
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ROTHWELL, FIGG, ERNST & MANBECK
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1425 K STREET, N.W., SUITE 800
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WASHINGTON, D.C. 20005
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