Patent Assignment Details
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| Reel/Frame: | 030812/0142 | |
| Pages: | 3 |
| | Recorded: | 07/16/2013 | | |
| Attorney Dkt #: | 2012-046USORG (0690U1) |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 029101 FRAME 0681. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT ASSIGNEE NAME IS AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/03/2015
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Application #:
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13647474
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Filing Dt:
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10/09/2012
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Publication #:
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Pub Dt:
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04/10/2014
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Title:
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TWO-SIDED-ACCESS EXTENDED WAFER-LEVEL BALL GRID ARRAY (EWLB) PACKAGE, ASSEMBLY AND METHOD
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Assignee
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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FLOYD ANDERSON
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4380 ZIEGLER ROAD
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FORT COLLINS, CO 80525
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