Patent Assignment Details
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Reel/Frame: | 010632/0144 | |
| Pages: | 2 |
| | Recorded: | 03/10/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/25/2001
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Application #:
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09522944
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Filing Dt:
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03/10/2000
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Title:
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Method for fabricating semiconductor device without having grooves at edge portions of STI
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Assignee
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416 MAETAN-DONG, PALDAL-GU |
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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KILE, MCINTYRE, HARBIN & LEE
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EUGENE M. LEE
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1101 PENNSYLVANIA AVENUE, N.W. SUITE 800
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WASHINGTON D.C 20004
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