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Patent Assignment Details
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Reel/Frame:066543/0144   Pages: 3
Recorded: 02/23/2024
Attorney Dkt #:4630.1890002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/16/2024
Application #:
17875658
Filing Dt:
07/28/2022
Publication #:
Pub Dt:
01/19/2023
Title:
APPARATUS AND METHOD FOR WAFER CLEANING
Assignor
1
Exec Dt:
02/23/2022
Assignee
1
NO. 8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
EDITH THOMPSON
1101 K. STREET, 10TH FLOOR
WASHINGTON, DC 20005

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