Patent Assignment Details
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| Reel/Frame: | 031854/0145 | |
| Pages: | 4 |
| | Recorded: | 12/27/2013 | | |
| Attorney Dkt #: | CHI-001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/15/2018
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Application #:
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14142152
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Filing Dt:
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12/27/2013
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Publication #:
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Pub Dt:
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10/09/2014
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Title:
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BONDING WIRE FOR HIGH-SPEED SIGNAL LINE
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Assignee
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| 7-3, MARUNOUCHI 2-CHOME, |
| TOKYO BUILDING 22F, |
| CHIYODA-KU, TOKYO, JAPAN 100-6422 |
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Correspondence name and address
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KANESAKA BERNER AND PARTNERS LLP
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2318 MILL ROAD
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SUITE 1400
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ALEXANDRIA, VA 22314-2848
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