Patent Assignment Details
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| Reel/Frame: | 037457/0145 | |
| Pages: | 4 |
| | Recorded: | 01/11/2016 | | |
| Attorney Dkt #: | TWT04287/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/09/2018
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Application #:
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14992013
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Filing Dt:
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01/10/2016
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Publication #:
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Pub Dt:
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07/13/2017
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Title:
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WAFERS HAVING A DIE REGION AND A SCRIBE-LINE REGION ADJACENT TO THE DIE REGION
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Assignee
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| NO.667, FUHSING 3RD RD., HWA-YA TECHNOLOGY PARK, GUISHAN DIST. |
| TAOYUAN CITY, TAIWAN 333 |
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Correspondence name and address
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CKC & PARTNERS CO., LTD.
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12TH FLOOR, RUTTONJEE HOUSE
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11 DUDDELL STREET
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HONG KONG, HONG KONG
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