Patent Assignment Details
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| Reel/Frame: | 016108/0146 | |
| Pages: | 3 |
| | Recorded: | 12/14/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/10/2006
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Application #:
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11012032
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Filing Dt:
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12/14/2004
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Publication #:
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Pub Dt:
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06/15/2006
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Title:
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SOLDER BUMP COMPOSITION FOR FLIP CHIP
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Assignee
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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Correspondence name and address
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WILLIAM H. MURRAY, ESQUIRE
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DUANE MORRIS LLP
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ONE LIBERTY PLACE
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PHILADELPHIA, PA 19103
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