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Reel/Frame:019702/0149   Pages: 3
Recorded: 07/30/2007
Attorney Dkt #:ALPSP304
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/28/2009
Application #:
11888121
Filing Dt:
07/30/2007
Publication #:
Pub Dt:
03/06/2008
Title:
MOUNTING CIRCUIT AND METHOD FOR PRODUCING SEMICONDUCTOR-CHIP-MOUNTING CIRCUIT
Assignor
1
Exec Dt:
07/20/2007
Assignee
1
1-7 YUKIGAYA, OTSUKA-CHO
OTA-KU, TOKYO, JAPAN
Correspondence name and address
BEYER WEAVER LLP
P.O. BOX 70250
OAKLAND, CA 94612-0250

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