Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 030771/0150 | |
| Pages: | 4 |
| | Recorded: | 07/10/2013 | | |
Attorney Dkt #: | 093005C1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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06/21/2011
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Application #:
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12202342
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Filing Dt:
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09/01/2008
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Publication #:
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Pub Dt:
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04/30/2009
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Title:
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CHIP STRUCTURE
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Patent #:
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Issue Dt:
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04/05/2011
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Application #:
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12273546
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Filing Dt:
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11/19/2008
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Publication #:
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Pub Dt:
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04/30/2009
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Title:
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OVER-PASSIVATION PROCESS OF FORMING POLYMER LAYER OVER IC CHIP
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Patent #:
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Issue Dt:
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04/17/2012
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Application #:
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13098379
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Filing Dt:
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04/29/2011
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Publication #:
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Pub Dt:
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08/25/2011
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Title:
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CHIP STRUCTURE
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Patent #:
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Issue Dt:
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06/03/2014
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Application #:
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13271004
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Filing Dt:
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10/11/2011
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Publication #:
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Pub Dt:
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02/02/2012
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Title:
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SOLDER INTERCONNECT ON IC CHIP
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Assignee
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ROOM 301/302, NO 47, PARK 2ND RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN ROC |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DRIVE
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SAN DIEGO, CA 92121-1714
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