Patent Assignment Details
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Reel/Frame: | 009286/0154 | |
| Pages: | 5 |
| | Recorded: | 06/23/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/13/2001
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Application #:
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09046136
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Filing Dt:
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03/23/1998
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Title:
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STACKED SEMICONDUCTOR CHIP PACKAGE HAVING EXTERNAL TERMINAL PADS AND STACKABLE CHIPS HAVING A PROTECTION LAYER
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Assignee
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1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU |
CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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TERRY L. CLARK
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P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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