Patent Assignment Details
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Reel/Frame: | 022723/0154 | |
| Pages: | 6 |
| | Recorded: | 05/21/2009 | | |
Attorney Dkt #: | CS2008/102&103 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/14/2011
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Application #:
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12470028
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Filing Dt:
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05/21/2009
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Publication #:
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Pub Dt:
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11/25/2010
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Title:
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METHOD OF MANUFACTURE AN INTEGRATED CIRCUIT SYSTEM WITH THROUGH SILICON VIA
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Assignee
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60 WOODLANDS INDUSTRIAL PARK D |
STREET 2 |
SINGAPORE 738406, SINGAPORE |
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Correspondence name and address
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MIKIO ISHIMARU
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL, SUITE # 330
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SUNNYVALE, CA 94087
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