Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 027289/0157 | |
| Pages: | 6 |
| | Recorded: | 11/29/2011 | | |
Attorney Dkt #: | 1133-291US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2000
|
Application #:
|
09116815
|
Filing Dt:
|
06/03/1998
|
Title:
|
PROCESS FOR BONDING MICROMACHINED WAFERS USING SOLDER
|
|
Assignee
|
|
|
MAIL STOP D-32 |
ERC BUILDING |
KOKOMO, INDIANA 46904 |
|
Correspondence name and address
|
|
SHUMAKER & SIEFFERT, P.A.
|
|
1625 RADIO DRIVE
|
|
SUITE 300
|
|
WOODBURY, MN 55125
|
Search Results as of:
09/25/2024 12:10 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|