Patent Assignment Details
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Reel/Frame: | 006587/0158 | |
| Pages: | 2 |
| | Recorded: | 06/18/1993 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/1992
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Application #:
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07551095
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Filing Dt:
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07/11/1990
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Title:
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METHOD OF STACKING SEMICONDUCTOR SUBSTRATES FOR FABRICATION OF THREE-DIMENSIONAL INTEGRATED CIRCUIT
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Assignee
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1-1, 3-CHOME, HIGASHI-IKEBUKURO, TOSHIMA-KU, TOKYO, JAPAN |
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Correspondence name and address
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JOHN H. MION, ESQ.
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SUGHRUE, MION, ZINN, MACPEAK & SEAS
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2100 PENNSYLVANIA AVENUE, N.W., STE. 800
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WASHINGTON, DC 20037-3202
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