Total properties:
88
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2000
|
Application #:
|
08892795
|
Filing Dt:
|
07/15/1997
|
Title:
|
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2002
|
Application #:
|
08914171
|
Filing Dt:
|
08/19/1997
|
Title:
|
WATER-REPELLENT GLASS PANE AND METHOD FOR PRODUCING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/12/1999
|
Application #:
|
08971642
|
Filing Dt:
|
11/17/1997
|
Title:
|
GRINDING PROCESS AND APPARATUS FOR PLANARIZING SAWED WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/03/2001
|
Application #:
|
09228113
|
Filing Dt:
|
01/11/1999
|
Title:
|
APPARATUS AND METHOD FOR RELIABLY RELEASING WET, THIN WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/06/2001
|
Application #:
|
09248167
|
Filing Dt:
|
02/09/1999
|
Title:
|
SLURRY PUMP CONTROL SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2002
|
Application #:
|
09407472
|
Filing Dt:
|
09/28/1999
|
Publication #:
|
|
Pub Dt:
|
06/06/2002
| | | | |
Title:
|
METHOD FOR CHEMICAL MECHANICAL POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/26/2002
|
Application #:
|
09432144
|
Filing Dt:
|
11/02/1999
|
Title:
|
METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
05/08/2001
|
Application #:
|
09432882
|
Filing Dt:
|
11/02/1999
|
Title:
|
PAD QUICK RELEASE DEVICE FOR CHEMICAL MECHANICAL POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
11/26/2002
|
Application #:
|
09590470
|
Filing Dt:
|
06/09/2000
|
Title:
|
Polishing pad with built-in optical sensor
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2002
|
Application #:
|
09693040
|
Filing Dt:
|
10/20/2000
|
Title:
|
PAD QUICK RELEASE DEVICE FOR CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
02/12/2002
|
Application #:
|
09693064
|
Filing Dt:
|
10/20/2000
|
Title:
|
Multi-pad apparatus for chemical mechanical planarization
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2003
|
Application #:
|
09693148
|
Filing Dt:
|
10/20/2000
|
Title:
|
PAD SUPPORT APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/2003
|
Application #:
|
09693152
|
Filing Dt:
|
10/20/2000
|
Title:
|
PAD RETRIEVAL APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2002
|
Application #:
|
09693153
|
Filing Dt:
|
10/20/2000
|
Title:
|
PAD TRANSFER APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2003
|
Application #:
|
09699202
|
Filing Dt:
|
10/26/2000
|
Title:
|
POLISHING CHEMICAL DELIVERY FOR SMALL HEAD CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2003
|
Application #:
|
09699283
|
Filing Dt:
|
10/26/2000
|
Title:
|
HIGH PLANARITY CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2003
|
Application #:
|
09699285
|
Filing Dt:
|
10/26/2000
|
Title:
|
MULTI-ACTION CHEMICAL MECHANICAL PLANARIZATION DEVICE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
01/28/2003
|
Application #:
|
09699287
|
Filing Dt:
|
10/26/2000
|
Title:
|
SPHERICAL DRIVE ASSEMBLY FOR CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
04/30/2002
|
Application #:
|
09699289
|
Filing Dt:
|
10/26/2000
|
Title:
|
WAFER SUPPORT FOR CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/07/2003
|
Application #:
|
09699290
|
Filing Dt:
|
10/26/2000
|
Title:
|
IN SITU FEATURE HEIGHT MEASUREMENT DURING CMP
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2003
|
Application #:
|
09706336
|
Filing Dt:
|
11/03/2000
|
Title:
|
HARD POLISHING PAD FOR CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
02/17/2004
|
Application #:
|
09706349
|
Filing Dt:
|
11/03/2000
|
Title:
|
COMBINED CHEMICAL MECHANICAL PLANARIZATION AND CLEANING
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2003
|
Application #:
|
09709972
|
Filing Dt:
|
11/10/2000
|
Title:
|
SUBAPERATURE CHEMICAL MECHANICAL PLANARIZATION WITH POLISHING PAD CONDITIONING
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2003
|
Application #:
|
09777501
|
Filing Dt:
|
02/05/2001
|
Title:
|
SLURRY PUMP CONTROL SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
05/25/2004
|
Application #:
|
09970252
|
Filing Dt:
|
09/29/2001
|
Publication #:
|
|
Pub Dt:
|
07/11/2002
| | | | |
Title:
|
POLISHING PAD WITH BUILT-IN OPTICAL SENSOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/2004
|
Application #:
|
10059701
|
Filing Dt:
|
01/29/2002
|
Publication #:
|
|
Pub Dt:
|
07/31/2003
| | | | |
Title:
|
METHOD OF SPIN ETCHING WAFERS WITH AN ALKALI SOLUTION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/26/2005
|
Application #:
|
10065589
|
Filing Dt:
|
10/31/2002
|
Publication #:
|
|
Pub Dt:
|
05/06/2004
| | | | |
Title:
|
METHOD OF PREPARING WHOLE SEMICONDUCTOR WAFER FOR ANALYSIS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2004
|
Application #:
|
10145332
|
Filing Dt:
|
05/13/2002
|
Publication #:
|
|
Pub Dt:
|
11/13/2003
| | | | |
Title:
|
METHOD FOR MAKING A POLISHING PAD WITH BUILT-IN OPTICAL SENSOR
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2004
|
Application #:
|
10145332
|
Filing Dt:
|
05/13/2002
|
Publication #:
|
|
Pub Dt:
|
11/13/2003
| | | | |
Title:
|
METHOD FOR MAKING A POLISHING PAD WITH BUILT-IN OPTICAL SENSOR
|
|
|
Patent #:
|
|
Issue Dt:
|
04/27/2004
|
Application #:
|
10146494
|
Filing Dt:
|
05/14/2002
|
Publication #:
|
|
Pub Dt:
|
11/20/2003
| | | | |
Title:
|
POLISHING PAD WITH OPTICAL SENSOR
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2005
|
Application #:
|
10216107
|
Filing Dt:
|
08/08/2002
|
Publication #:
|
|
Pub Dt:
|
11/20/2003
| | | | |
Title:
|
POLISHING PAD SENSOR ASSEMBLY WITH A DAMPING PAD
|
|
|
Patent #:
|
|
Issue Dt:
|
03/28/2006
|
Application #:
|
10249433
|
Filing Dt:
|
04/08/2003
|
Publication #:
|
|
Pub Dt:
|
11/13/2003
| | | | |
Title:
|
PROTECTION OF WORK PIECE DURING SURFACE PROCESSING
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2003
|
Application #:
|
10259536
|
Filing Dt:
|
09/26/2002
|
Publication #:
|
|
Pub Dt:
|
05/01/2003
| | | | |
Title:
|
METHOD FOR APPLYING AN INSERT OR TAPE TO CHUCKS OR WAFER CARRIERS USED FOR GRINDING, POLISHING, OR PLANARIZING WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2003
|
Application #:
|
10259536
|
Filing Dt:
|
09/26/2002
|
Publication #:
|
|
Pub Dt:
|
05/01/2003
| | | | |
Title:
|
METHOD FOR APPLYING AN INSERT OR TAPE TO CHUCKS OR WAFER CARRIERS USED FOR GRINDING, POLISHING, OR PLANARIZING WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2004
|
Application #:
|
10303621
|
Filing Dt:
|
11/25/2002
|
Publication #:
|
|
Pub Dt:
|
06/12/2003
| | | | |
Title:
|
ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2005
|
Application #:
|
10315746
|
Filing Dt:
|
12/10/2002
|
Publication #:
|
|
Pub Dt:
|
07/17/2003
| | | | |
Title:
|
METHOD OF BACKGRINDING WAFERS WHILE LEAVING BACKGRINDING TAPE ON A CHUCK
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2005
|
Application #:
|
10315746
|
Filing Dt:
|
12/10/2002
|
Publication #:
|
|
Pub Dt:
|
07/17/2003
| | | | |
Title:
|
METHOD OF BACKGRINDING WAFERS WHILE LEAVING BACKGRINDING TAPE ON A CHUCK
|
|
|
Patent #:
|
|
Issue Dt:
|
02/15/2005
|
Application #:
|
10327712
|
Filing Dt:
|
12/19/2002
|
Publication #:
|
|
Pub Dt:
|
03/11/2004
| | | | |
Title:
|
MODULAR METHOD FOR CHEMICAL MECHANICAL PLANARIZATION
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2005
|
Application #:
|
10338413
|
Filing Dt:
|
01/08/2003
|
Publication #:
|
|
Pub Dt:
|
07/08/2004
| | | | |
Title:
|
PIVOTAL GUARD COVER FOR HAND-HELD KITCHEN PEELER
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2005
|
Application #:
|
10365081
|
Filing Dt:
|
02/11/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
DEVICE FOR SUPPORTING THIN SEMICONDUCTOR WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/20/2005
|
Application #:
|
10374494
|
Filing Dt:
|
02/25/2003
|
Publication #:
|
|
Pub Dt:
|
08/14/2003
| | | | |
Title:
|
SUBAPERTURE CHEMICAL MECHANICAL PLANARIZATION WITH POLISHING PAD CONDITIONING
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2006
|
Application #:
|
10407833
|
Filing Dt:
|
04/04/2003
|
Publication #:
|
|
Pub Dt:
|
10/07/2004
| | | | |
Title:
|
GRINDING APPARATUS AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2007
|
Application #:
|
10425896
|
Filing Dt:
|
04/28/2003
|
Publication #:
|
|
Pub Dt:
|
11/18/2004
| | | | |
Title:
|
WAFER CARRIER PIVOT MECHANISM
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2006
|
Application #:
|
10452411
|
Filing Dt:
|
05/30/2003
|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
Title:
|
BACK PRESSURE CONTROL SYSTEM FOR CMP AND WAFER POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2006
|
Application #:
|
10452411
|
Filing Dt:
|
05/30/2003
|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
Title:
|
BACK PRESSURE CONTROL SYSTEM FOR CMP AND WAFER POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2005
|
Application #:
|
10626490
|
Filing Dt:
|
07/22/2003
|
Publication #:
|
|
Pub Dt:
|
07/22/2004
| | | | |
Title:
|
SLURRY PUMP CONTROL SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2005
|
Application #:
|
10680995
|
Filing Dt:
|
10/07/2003
|
Publication #:
|
|
Pub Dt:
|
04/07/2005
| | | | |
Title:
|
RETAINING RING FOR WAFER CARRIERS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/20/2005
|
Application #:
|
10681047
|
Filing Dt:
|
10/07/2003
|
Title:
|
IN SITU FEATURE HEIGHT MEASUREMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10717032
|
Filing Dt:
|
11/18/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHOD OF BACKGRINDING WAFERS WHILE LEAVING BACKGRINDING TAPE ON A CHUCK
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10717032
|
Filing Dt:
|
11/18/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHOD OF BACKGRINDING WAFERS WHILE LEAVING BACKGRINDING TAPE ON A CHUCK
|
|
|
Patent #:
|
|
Issue Dt:
|
06/26/2007
|
Application #:
|
10754360
|
Filing Dt:
|
01/08/2004
|
Publication #:
|
|
Pub Dt:
|
07/14/2005
| | | | |
Title:
|
DEVICES AND METHODS FOR OPTICAL ENDPOINT DETECTION DURING SEMICONDUCTOR WAFER POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10785393
|
Filing Dt:
|
02/23/2004
|
Publication #:
|
|
Pub Dt:
|
11/18/2004
| | | | |
Title:
|
ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
01/17/2006
|
Application #:
|
10850346
|
Filing Dt:
|
05/20/2004
|
Publication #:
|
|
Pub Dt:
|
01/13/2005
| | | | |
Title:
|
POLISHING PAD WITH BUILT-IN OPTICAL SENSOR
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/2007
|
Application #:
|
10860381
|
Filing Dt:
|
06/01/2004
|
Publication #:
|
|
Pub Dt:
|
01/13/2005
| | | | |
Title:
|
CHUCK FOR SUPPORTING WAFERS WITH A FLUID
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2006
|
Application #:
|
11046502
|
Filing Dt:
|
01/28/2005
|
Title:
|
CHEMICAL-MECHANICAL PLANARIZATION TOOL FORCE CALIBRATION METHOD AND SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
04/25/2006
|
Application #:
|
11055550
|
Filing Dt:
|
02/10/2005
|
Publication #:
|
|
Pub Dt:
|
09/29/2005
| | | | |
Title:
|
WAFER CARRIER WITH PRESSURIZED MEMBRANE AND RETAINING RING ACTUATOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
11072636
|
Filing Dt:
|
03/04/2005
|
Publication #:
|
|
Pub Dt:
|
09/15/2005
| | | | |
Title:
|
INDEPENDENT EDGE CONTROL FOR CMP CARRIERS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
11084475
|
Filing Dt:
|
03/18/2005
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
Title:
|
RETAINING RING FOR WAFER CARRIERS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2007
|
Application #:
|
11173992
|
Filing Dt:
|
07/01/2005
|
Publication #:
|
|
Pub Dt:
|
02/16/2006
| | | | |
Title:
|
METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/01/2006
|
Application #:
|
11334148
|
Filing Dt:
|
01/17/2006
|
Publication #:
|
|
Pub Dt:
|
06/01/2006
| | | | |
Title:
|
POLISHING PAD WITH BUILT-IN OPTICAL SENSOR
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2008
|
Application #:
|
11369700
|
Filing Dt:
|
03/06/2006
|
Publication #:
|
|
Pub Dt:
|
07/27/2006
| | | | |
Title:
|
BACK PRESSURE CONTROL SYSTEM FOR CMP AND WAFER POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2008
|
Application #:
|
11369700
|
Filing Dt:
|
03/06/2006
|
Publication #:
|
|
Pub Dt:
|
07/27/2006
| | | | |
Title:
|
BACK PRESSURE CONTROL SYSTEM FOR CMP AND WAFER POLISHING
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11393041
|
Filing Dt:
|
03/29/2006
|
Publication #:
|
|
Pub Dt:
|
10/11/2007
| | | | |
Title:
|
Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
|
|
|
Patent #:
|
|
Issue Dt:
|
11/07/2006
|
Application #:
|
11410440
|
Filing Dt:
|
04/24/2006
|
Publication #:
|
|
Pub Dt:
|
08/31/2006
| | | | |
Title:
|
WAFER CARRIER WITH PRESSURIZED MEMBRANE AND RETAINING RING ACTUATOR
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2007
|
Application #:
|
11443788
|
Filing Dt:
|
05/30/2006
|
Publication #:
|
|
Pub Dt:
|
09/28/2006
| | | | |
Title:
|
ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2008
|
Application #:
|
11548213
|
Filing Dt:
|
10/10/2006
|
Publication #:
|
|
Pub Dt:
|
06/07/2007
| | | | |
Title:
|
GRINDING APPARATUS AND METHOD
|
|
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Patent #:
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Issue Dt:
|
07/03/2007
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Application #:
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11594267
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Filing Dt:
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11/07/2006
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Publication #:
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Pub Dt:
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03/08/2007
| | | | |
Title:
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WAFER CARRIER WITH PRESSURIZED MEMBRANE AND RETAINING RING ACTUATOR
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Patent #:
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Issue Dt:
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06/23/2009
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Application #:
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11600978
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Filing Dt:
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11/17/2006
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Publication #:
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|
Pub Dt:
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06/28/2007
| | | | |
Title:
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ROBOT CALIBRATION SYSTEM AND METHOD
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|
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Patent #:
|
|
Issue Dt:
|
06/23/2009
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Application #:
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11768873
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Filing Dt:
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06/26/2007
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Publication #:
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Pub Dt:
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02/07/2008
| | | | |
Title:
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METHODS FOR OPTICAL ENDPOINT DETECTION DURING SEMICONDUCTOR WAFER POLISHING
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Patent #:
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Issue Dt:
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11/08/2011
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Application #:
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11829798
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Filing Dt:
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07/27/2007
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Publication #:
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Pub Dt:
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11/22/2007
| | | | |
Title:
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METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
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|
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Patent #:
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|
Issue Dt:
|
06/14/2011
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Application #:
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11969175
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Filing Dt:
|
01/03/2008
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Publication #:
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Pub Dt:
|
07/09/2009
| | | | |
Title:
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FLEXIBLE MEMBRANE ASSEMBLY FOR A CMP SYSTEM AND METHOD OF USING
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|
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Patent #:
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|
Issue Dt:
|
05/22/2012
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Application #:
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12205861
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Filing Dt:
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09/06/2008
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Publication #:
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Pub Dt:
|
03/11/2010
| | | | |
Title:
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CMP SYSTEM WITH WIRELESS ENDPOINT DETECTION SYSTEM
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|
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Patent #:
|
|
Issue Dt:
|
03/13/2012
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Application #:
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12287550
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Filing Dt:
|
10/10/2008
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Publication #:
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|
Pub Dt:
|
04/15/2010
| | | | |
Title:
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GRINDING APPARATUS HAVING AN EXTENDABLE WHEEL MOUNT
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|
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Patent #:
|
|
Issue Dt:
|
04/05/2011
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Application #:
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12705091
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Filing Dt:
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02/12/2010
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Publication #:
|
|
Pub Dt:
|
06/10/2010
| | | | |
Title:
|
ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
12806518
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Filing Dt:
|
08/16/2010
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Publication #:
|
|
Pub Dt:
|
02/16/2012
| | | | |
Title:
|
Replaceable cover for membrane carrier
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
13243808
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Filing Dt:
|
09/23/2011
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Publication #:
|
|
Pub Dt:
|
03/28/2013
| | | | |
Title:
|
Wafer Carrier with Flexible Pressure Plate
|
|
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Patent #:
|
|
Issue Dt:
|
06/03/2014
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Application #:
|
13252897
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Filing Dt:
|
10/04/2011
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Publication #:
|
|
Pub Dt:
|
04/12/2012
| | | | |
Title:
|
CMP RETAINING RING WITH SOFT RETAINING RING INSERT
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|
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Patent #:
|
|
Issue Dt:
|
08/27/2013
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Application #:
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13291800
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Filing Dt:
|
11/08/2011
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Publication #:
|
|
Pub Dt:
|
05/09/2013
| | | | |
Title:
|
SYSTEM AND METHOD FOR IN SITU MONITORING OF TOP WAFER THICKNESS IN A STACK OF WAFERS
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
13573148
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Filing Dt:
|
08/27/2012
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Publication #:
|
|
Pub Dt:
|
02/27/2014
| | | | |
Title:
|
Method for grinding wafers by shaping resilient chuck covering
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|
|
Patent #:
|
|
Issue Dt:
|
03/03/2015
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Application #:
|
13656514
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Filing Dt:
|
10/19/2012
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Publication #:
|
|
Pub Dt:
|
04/25/2013
| | | | |
Title:
|
SYSTEMS AND METHODS OF WAFER GRINDING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2015
|
Application #:
|
13656514
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Filing Dt:
|
10/19/2012
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Publication #:
|
|
Pub Dt:
|
04/25/2013
| | | | |
Title:
|
SYSTEMS AND METHODS OF WAFER GRINDING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2014
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Application #:
|
13694723
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Filing Dt:
|
12/27/2012
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Publication #:
|
|
Pub Dt:
|
07/03/2014
| | | | |
Title:
|
Method and apparatus for cleaning grinding work chuck using a vacuum
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|
|
Patent #:
|
|
Issue Dt:
|
07/19/2016
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Application #:
|
13740101
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Filing Dt:
|
01/11/2013
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Publication #:
|
|
Pub Dt:
|
05/23/2013
| | | | |
Title:
|
SYSTEMS AND METHODS OF PROCESSING SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/04/2016
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Application #:
|
14042591
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Filing Dt:
|
09/30/2013
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Publication #:
|
|
Pub Dt:
|
05/15/2014
| | | | |
Title:
|
METHODS AND SYSTEMS FOR USE IN GRIND SHAPE CONTROL ADAPTATION
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2017
|
Application #:
|
14042600
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Filing Dt:
|
09/30/2013
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Publication #:
|
|
Pub Dt:
|
05/15/2014
| | | | |
Title:
|
METHODS AND SYSTEMS FOR USE IN GRIND SPINDLE ALIGNMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
11/24/2015
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Application #:
|
14295013
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Filing Dt:
|
06/03/2014
|
Publication #:
|
|
Pub Dt:
|
09/25/2014
| | | | |
Title:
|
CMP RETAINING RING WITH SOFT RETAINING RING INSERT
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/2015
|
Application #:
|
14525115
|
Filing Dt:
|
10/27/2014
|
Publication #:
|
|
Pub Dt:
|
04/30/2015
| | | | |
Title:
|
METHOD OF GRINDING WAFER STACKS TO PROVIDE UNIFORM RESIDUAL SILICON THICKNESS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/2015
|
Application #:
|
14525115
|
Filing Dt:
|
10/27/2014
|
Publication #:
|
|
Pub Dt:
|
04/30/2015
| | | | |
Title:
|
METHOD OF GRINDING WAFER STACKS TO PROVIDE UNIFORM RESIDUAL SILICON THICKNESS
|
|