Patent Assignment Details
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| Reel/Frame: | 037681/0159 | |
| Pages: | 4 |
| | Recorded: | 02/02/2016 | | |
| Attorney Dkt #: | 7000.804 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15013091
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Filing Dt:
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02/02/2016
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Publication #:
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Pub Dt:
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08/03/2017
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Title:
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Method of Fabricating High-Conductivity Thick-film Copper Paste Coated with Nano-Silver for Being Sintered in the Air
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Assignees
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| NO.1, UNIVERSITY ROAD, |
| TAINAN, TAIWAN 701 |
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| NO.31-1, XINGBANG RD., GUISHAN DIST., |
| TAOYUAN CITY, TAIWAN 333 |
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Correspondence name and address
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JACKSON INTELLECTUAL PROPERTY GROUP PLLC
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106 STARVALE LANE
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SHIPMAN, VA 22971
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