Patent Assignment Details
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| Reel/Frame: | 050617/0159 | |
| Pages: | 4 |
| | Recorded: | 10/03/2019 | | |
| Attorney Dkt #: | HA152-001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16500389
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Filing Dt:
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10/02/2019
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Publication #:
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Pub Dt:
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03/19/2020
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Title:
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Printed circuit boards including a rigid region on which devices or connectors are to be mounted and a flexible region that is bendable, and methods of manufacturing same
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Assignee
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| (CHEONAN THE FOURTH LOCAL INDUSTRIAL COMPLEX) |
| 19-1 BLOCK, 90, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU, CHEONAN-SI |
| CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31040 |
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Correspondence name and address
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WELLS ST. JOHN P.S.
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601 W. MAIN AVENUE, SUITE 600
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SPOKANE, WA 99201
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