Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 006694/0161 | |
| Pages: | 5 |
| | Recorded: | 08/30/1993 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/14/1995
|
Application #:
|
08069640
|
Filing Dt:
|
06/01/1993
|
Title:
|
TIN BISMUTH SOLDER PASTE, AND METHOD USING PASTE TO FORM CONNECTION HAVING IMPROVED HIGH TEMPERATURE PROPERTIES
|
|
Assignee
|
|
|
CORPORATE OFFICES, INTELLECTUAL PROPERTY DEPARTMENT, 1303 E. ALONGQUIN ROAD |
SCHAUMBURG, ILLINOIS 60196 |
|
Correspondence name and address
|
|
MOTOROLA, INC.
|
|
DOUGLAS D. FEKETE
|
|
INTELLECTUAL PROPERTY DEPT.
|
|
1303 E. ALGONQUIN RD., CORPORATE OFFICES
|
|
SCHAUMBURG, IL 60196
|
Search Results as of:
05/25/2024 08:27 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|