Patent Assignment Details
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| Reel/Frame: | 056254/0161 | |
| Pages: | 5 |
| | Recorded: | 05/14/2021 | | |
| Attorney Dkt #: | 088888-1082289-006000US |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA TO INCLUDE THE SECOND ASSIGNOR. PREVIOUSLY RECORDED ON REEL 050359 FRAME 0167. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/2021
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Application #:
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16566813
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Filing Dt:
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09/10/2019
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Publication #:
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Pub Dt:
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07/09/2020
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Title:
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MOLDED INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
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Assignee
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| S - SITE, LOT 52986, TAMAN MERU INDUSTRIAL ESTATE |
| JELAPANG, P.O. BOX 380 |
| IPOH, PERAK DARUL RIDZUAN, MALAYSIA 30020 |
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Correspondence name and address
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KILPATRICK TOWNSEND & STOCKTON LLP
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1100 PEACHTREE STREET
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SUITE 2800
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ATLANTA, GA 30309
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