Patent Assignment Details
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Reel/Frame: | 008182/0162 | |
| Pages: | 2 |
| | Recorded: | 05/23/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/06/1999
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Application #:
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08587262
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Filing Dt:
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01/16/1996
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Title:
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ELECTROLESS CU DEPOSITION ON A BARRIER LAYER BY CU CONTACT DISPLACEMENT FOR ULSI APPLICATIONS
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Assignee
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20 THORNWOOD DRIVE, SUITE 105 |
CORNELL BUSINESS & TECHNOLOGY PARK |
ITHACA, NEW YORK 14850 |
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Correspondence name and address
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WILLIAM W. KIDD
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P.O. BOX 13143
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AUSTIN, TX 78711
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