USPTO Assignments on the Web

	United States Patent and Trademark Office
	Home\|Site Index\|Search\|Guides\|Contacts\|eBusiness\|eBiz alerts\|News\|Help

Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	016561/0162			Pages:	3
		Recorded:	07/22/2005
Attorney Dkt #:	socket 5.2-001
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 12

Patent #:	6782610	Issue Dt:	08/31/2004	Application #:	09466895	Filing Dt:	12/20/1999
Title:	METHOD FOR FABRICATING A WIRING SUBSTRATE

Patent #:	6528874	Issue Dt:	03/04/2003	Application #:	09685799	Filing Dt:	10/11/2000
Title:	WIRING CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

Patent #:	6617236	Issue Dt:	09/09/2003	Application #:	10072351	Filing Dt:	02/07/2002
Publication #:	US20020086514	Pub Dt:	07/04/2002
Title:	FABRICATION METHOD OF WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

Patent #:	6828221	Issue Dt:	12/07/2004	Application #:	10139237	Filing Dt:	05/07/2002
Publication #:	US20030143833	Pub Dt:	07/31/2003
Title:	MANUFACTURING METHOD FOR WIRING CIRCUIT SUBSTRATES

Patent #:	6646337	Issue Dt:	11/11/2003	Application #:	10287633	Filing Dt:	11/05/2002
Publication #:	US20030151067	Pub Dt:	08/14/2003
Title:	WIRING CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREFOR

Patent #:	6884709	Issue Dt:	04/26/2005	Application #:	10358229	Filing Dt:	02/05/2003
Publication #:	US20030155653	Pub Dt:	08/21/2003
Title:	CONNECTING MEMBER BETWEEN WIRING FILMS, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE

Patent #:	NONE	Issue Dt:		Application #:	10450844	Filing Dt:	06/26/2003
Publication #:	US20050097727	Pub Dt:	05/12/2005
Title:	Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board

Patent #:	NONE	Issue Dt:		Application #:	10812349	Filing Dt:	03/30/2004
Publication #:	US20040201096	Pub Dt:	10/14/2004
Title:	Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

Patent #:	7096578	Issue Dt:	08/29/2006	Application #:	10823611	Filing Dt:	04/14/2004
Publication #:	US20040197962	Pub Dt:	10/07/2004
Title:	MANUFACTURING METHOD FOR WIRING CIRCUIT SUBSTRATE

Patent #:	7342802	Issue Dt:	03/11/2008	Application #:	10880588	Filing Dt:	07/01/2004
Publication #:	US20050000729	Pub Dt:	01/06/2005
Title:	MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE

Patent #:	7238603	Issue Dt:	07/03/2007	Application #:	11029423	Filing Dt:	01/06/2005
Publication #:	US20050161804	Pub Dt:	07/28/2005
Title:	CONNECTING MEMBER BETWEEN WIRING FILMS, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE

Patent #:	NONE	Issue Dt:		Application #:	11085108	Filing Dt:	03/22/2005
Publication #:	US20050224256	Pub Dt:	10/13/2005
Title:	Interlayer member used for producing multilayer wiring board and method of producing the same

Assignor

Exec Dt:

05/31/2005

Assignee

3099 ORCHARD DRIVE

SAN JOSE, CALIFORNIA 95134

Correspondence name and address
	DARYL K. NEFF
	LERNER, DAVID, LITTENBERG ET AL.
	600 SOUTH AVENUE WEST
	WESTFIELD, NJ 07090

Search Results as of: 05/28/2024 11:50 PM

If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6

Web interface last modified: August 25, 2017 v.2.6