Patent Assignment Details
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| Reel/Frame: | 029859/0162 | |
| Pages: | 3 |
| | Recorded: | 02/22/2013 | | |
| Attorney Dkt #: | 20728.30 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12357279
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Filing Dt:
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01/21/2009
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Publication #:
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Pub Dt:
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07/30/2009
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Title:
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Wafer Level Chip Scale Packages Including Redistribution Substrates
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Assignee
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| 82-3, DODANG-DONG, WOMNI-GU DISTRICT, GYEONGGI-DO |
| BUCHEON-SI, KOREA, REPUBLIC OF 420-711 |
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Correspondence name and address
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KENNETH E. HORTON
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1800 EAGLE GATE TOWER
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60 EAST SOUTH TEMPLE
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SALT LAKE CITY, UT 84111
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