Patent Assignment Details
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| Reel/Frame: | 036189/0164 | |
| Pages: | 9 |
| | Recorded: | 07/27/2015 | | |
| Attorney Dkt #: | 24061.2806 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 033171 FRAME: 0895. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/29/2015
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Application #:
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14230779
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Filing Dt:
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03/31/2014
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Publication #:
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Pub Dt:
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09/25/2014
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Title:
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Method of Semiconductor Integrated Circuit Fabrication
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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HAYNES AND BOONE, LLP - IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, 75219 UNITED STATES
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