Patent Assignment Details
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| Reel/Frame: | 023110/0165 | |
| Pages: | 3 |
| | Recorded: | 08/18/2009 | | |
| Attorney Dkt #: | 2000.167700 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12507421
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Filing Dt:
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07/22/2009
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Publication #:
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Pub Dt:
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03/04/2010
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Title:
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REDUCING LEAKAGE AND DIELECTRIC BREAKDOWN IN DIELECTRIC MATERIALS OF METALLIZATION SYSTEMS OF SEMICONDUCTOR DEVICES BY FORMING RECESSES
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Assignee
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| MAPLES CORPORATE SERVICES LIMITED |
| PO BOX 309, UGLAND HOUSE |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1194 |
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Correspondence name and address
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J. MIKE AMERSON
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10333 RICHMOND, SUITE 1100
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HOUSTON, TX 77042
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