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Reel/Frame:026861/0165   Pages: 5
Recorded: 09/06/2011
Attorney Dkt #:PZ20-002A
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13226147
Filing Dt:
09/06/2011
Publication #:
Pub Dt:
03/08/2012
Title:
LED CHIP MODULES, METHOD FOR PACKAGING THE LED CHIP MODULES, AND MOVING FIXTURE THEREOF
Assignors
1
Exec Dt:
09/02/2011
2
Exec Dt:
09/02/2011
3
Exec Dt:
09/02/2011
4
Exec Dt:
09/02/2011
Assignees
1
NO.1, UNIVERSITY ROAD
TAINAN CITY, TAIWAN 701
2
8F.-9, NO.51, SEC.2, KEELUNG RD., XINYI DIST.
TAIPEI CITY, TAIWAN 110
Correspondence name and address
TAYSIE J. LOCKE
1900 MESA AVE.
COLORADO SPRINGS, CO 80906

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