Patent Assignment Details
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Reel/Frame: | 052042/0165 | |
| Pages: | 5 |
| | Recorded: | 03/06/2020 | | |
Attorney Dkt #: | JCLA78716-CIP |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16811830
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Filing Dt:
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03/06/2020
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Publication #:
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Pub Dt:
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07/02/2020
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Title:
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SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignee
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NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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Correspondence name and address
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J C PATENTS
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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09/22/2024 08:12 AM
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