Patent Assignment Details
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Reel/Frame: | 031956/0166 | |
| Pages: | 8 |
| | Recorded: | 01/09/2014 | | |
Attorney Dkt #: | 8947-000551-US-DVA |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME AND DATE OF THE 5TH INVENTOR PREVIOUSLY RECORDED ON REEL 031859 FRAME 0094. ASSIGNOR(S) HEREBY CONFIRMS THE 5TH INVENTOR'S NAME SHOULD READ "SUNG-WOO PARK" DATED NOVEMBER 25, 2013.. |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/28/2015
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Application #:
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14064467
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Filing Dt:
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10/28/2013
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Publication #:
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Pub Dt:
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02/20/2014
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Title:
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PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACTURING METHOD OF THE SAME
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Assignee
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129, SAMSUNG-RO, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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