Patent Assignment Details
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Reel/Frame: | 013474/0168 | |
| Pages: | 3 |
| | Recorded: | 03/13/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2005
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Application #:
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10249060
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Filing Dt:
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03/13/2003
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Publication #:
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Pub Dt:
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05/13/2004
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Title:
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CHIP PACKAGING STRUCTURE AND MANUFACTURING PROCESS THEREOF
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Assignee
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8F, NO. 533, CHUNG-CHENG RD., HSIN-TIEN CITY |
TAIPEI HSIEN, TAIWAN |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7 FLOOR-1, NO. 100
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ROOSEVELT ROAD, SECTION 2
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TAIPEI, TAIWAN 100
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