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Patent Assignment Details
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Reel/Frame:014985/0168   Pages: 2
Recorded: 02/12/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/01/2005
Application #:
10698057
Filing Dt:
10/30/2003
Publication #:
Pub Dt:
05/05/2005
Title:
STRESS-RELIEF LAYER FOR SEMICONDUCTOR APPLICATIONS
Assignor
1
Exec Dt:
01/08/2004
Assignee
1
NO. 3, LI-HSIN RD. 11
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU CITY, TAIWAN R.O.C. 30077
Correspondence name and address
INFINEON TECHNOLOGIES NORTH AMERICA CORP
ELSA KELLER
C/O SIEMENS CORPORATION, IP DEPARTMENT
186 WOOD AVE. S.
ISELIN, NJ 08830

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