Patent Assignment Details
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Reel/Frame: | 018607/0170 | |
| Pages: | 4 |
| | Recorded: | 12/09/2006 | | |
Attorney Dkt #: | 27-301 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/10/2010
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Application #:
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11608827
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Filing Dt:
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12/09/2006
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Publication #:
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Pub Dt:
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06/12/2008
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Title:
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STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
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Assignee
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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MIKIO ISHIMARU
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THE LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL, SUITE # 330
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SUNNYVALE, CA 94087
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