Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060401/0172 | |
| Pages: | 13 |
| | Recorded: | 04/08/2022 | | |
| Attorney Dkt #: | 2104010/1173-720 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE TITLE ON PAGE 1 OF THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 056571 FRAME: 0371. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17237828
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Filing Dt:
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04/22/2021
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Publication #:
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Pub Dt:
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10/27/2022
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Title:
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INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR INTERFACING AN IC CHIP(S) TO A PACKAGE SUBSTRATE, AND RELATED METHODS
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Assignee
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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Correspondence name and address
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W&T/QUALCOMM
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106 PINEDALE SPRINGS WAY
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CARY, NC 27511
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