Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 009614/0176 | |
| Pages: | 7 |
| | Recorded: | 12/03/1998 | | |
Conveyance: | SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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09/29/1981
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Application #:
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06122527
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Filing Dt:
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02/19/1980
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Title:
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CERAMIC LID ASSEMBLY FOR HERMETIC SEALING OF A SEMICONDUCTOR CHIP
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Patent #:
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Issue Dt:
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05/09/1995
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Application #:
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08064255
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Filing Dt:
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05/20/1993
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Title:
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METHOD FOR MAKING HEAT-DISSIPATING ELEMENTS FOR MICRO-ELECTRONIC DEVICES
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Patent #:
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Issue Dt:
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03/23/1999
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Application #:
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08654974
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Filing Dt:
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05/28/1996
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Title:
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HEAT-DISSIPATING PACKAGE FOR MICROCIRCUIT DEVICES
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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08819290
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Filing Dt:
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03/18/1997
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Title:
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ISOTROPIC CARBON/COPPER COMPOSITES
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Patent #:
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Issue Dt:
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03/02/1999
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Application #:
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08947478
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Filing Dt:
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10/10/1997
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Title:
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HEAT-DISSIPATING SUBSTRATE FOR MICRO-ELECTRONIC DEVICES AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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08/01/2000
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Application #:
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09080974
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Filing Dt:
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05/19/1998
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Title:
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EXOTHERMICALLY SINTERED HOMOGENEOUS COMPOSITE AND FABRICATION METHOD
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Assignee
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300 MAIN STREET |
STAMFORD, CONNECTICUT 06904 |
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Correspondence name and address
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ROBINSON & COLE, LLP
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AMY SPAN WERGELES, ESQ.
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280 TRUMBULL STREET
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HARTFORD, CT 06103-3597
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