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Patent Assignment Details
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Reel/Frame:021021/0177   Pages: 7
Recorded: 05/30/2008
Attorney Dkt #:461987-00001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 6
1
Patent #:
Issue Dt:
03/20/2001
Application #:
09172299
Filing Dt:
10/14/1998
Title:
PULSE REVERSE ELECTRODEPOSITION FOR METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES
2
Patent #:
Issue Dt:
06/27/2000
Application #:
09184247
Filing Dt:
11/02/1998
Title:
ELECTRODEPOSITION OF CATALYTIC METALS USING PULSED ELECTRIC FIELDS
3
Patent #:
Issue Dt:
04/24/2001
Application #:
09200959
Filing Dt:
11/30/1998
Title:
REMOVAL OF SACRIFICIAL CORES BY ELECTROCHEMICAL MACHINING
4
Patent #:
Issue Dt:
04/03/2001
Application #:
09239811
Filing Dt:
01/29/1999
Title:
ELECTRODEPOSITION OF METALS IN SMALL RECESSES FOR MANUFACTURE OF HIGH DENSITY INTERCONNECTS USING REVERSE PULS PLATING
5
Patent #:
NONE
Issue Dt:
Application #:
11354376
Filing Dt:
02/15/2006
Publication #:
Pub Dt:
09/21/2006
Title:
Electrochemical etching of circuitry for high density interconnect electronic modules
6
Patent #:
NONE
Issue Dt:
Application #:
11501551
Filing Dt:
08/09/2006
Publication #:
Pub Dt:
02/21/2008
Title:
Electrolytic looping for forming layering in the deposit of a coating
Assignor
1
Exec Dt:
05/29/2008
Assignee
1
315 HULS DRIVE
CLAYTON, OHIO 45315
Correspondence name and address
MARK P. LEVY
P.O. BOX 8801
2000 COURTHOUSE PLAZA, N.E.
DAYTON, OH 45402

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