Patent Assignment Details
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| Reel/Frame: | 049023/0177 | |
| Pages: | 4 |
| | Recorded: | 04/29/2019 | | |
| Attorney Dkt #: | 0118/0404PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/2020
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Application #:
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16397157
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Filing Dt:
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04/29/2019
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Publication #:
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Pub Dt:
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05/07/2020
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Title:
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METHOD OF MAKING AN INTERCONNECTION BETWEEN WAFERS AFTER WAFER LEVEL STACKING, BASED ON 3D-IC TECHNOLOGY
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Assignee
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| NO. 18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, |
| WUHAN, HUBEI, CHINA 430205 |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, PC
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4000 LEGATO RD., SUITE 310
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FAIRFAX, VA 22033
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