Patent Assignment Details
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Reel/Frame: | 015550/0179 | |
| Pages: | 4 |
| | Recorded: | 07/08/2004 | | |
Attorney Dkt #: | 3183/49 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/21/2006
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Application #:
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10716425
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Filing Dt:
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11/20/2003
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Publication #:
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Pub Dt:
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06/10/2004
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Title:
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METHOD FOR MAKING UBM PADS AND BUMPS ON WAFER
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Assignee
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NO. 26, CHIN 3RD |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG R.O.C., TAIWAN |
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Correspondence name and address
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DENNISON, SCHULTZ, DOUGHERTY &
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MACDONALD
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1727 KING STREET
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SUITE 105
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ALEXANDRIA, VA 22314
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