Patent Assignment Details
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Reel/Frame: | 016411/0180 | |
| Pages: | 2 |
| | Recorded: | 03/09/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/23/2007
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Application #:
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11074796
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Filing Dt:
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03/09/2005
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Publication #:
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Pub Dt:
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09/14/2006
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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26, CHIN 3RD RD. |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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STANLEY P. FISHER
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REED SMITH LLP
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3110 FAIRVIEW PARK DRIVE, SUITE 1400
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FALLS CHURCH, VIRGINIA 22042
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